ASUS ROG RG-07 Thermal Paste, 3 g, 2.5 W/m.K | PC Cooling, AIO

Maintain efficient heat transfer at the CPU interface with ASUS ROG RG-07 thermal paste. Designed for AIO liquid cooler installations and routine service work, this 3 g compound helps fill microscopic surface gaps between the processor and cooler base, supporting more consistent thermal contact than dry or uneven mounting surfaces. With a thermal conductivity rating of 2.5 W/m.K, RG-07 is positioned for builders and technicians who want a straightforward paste application without overcomplicating the install process. The compact 3 g package is well suited to a single high-value system or a small number of maintenance jobs, making it a sensible fit for workstation refreshes, custom builds, and replacement cooler installs. For teams that care about repeatable results, the value is in control: controlled application, controlled coverage, and controlled thermal transfer where it matters most. In systems where CPU cooling headroom affects sustained boost behavior, a quality thermal interface material is a small component with outsized impact.